AI Solutions
Innovation Roadshow

In arrivo a Milano a ottobre

Connettiti con i nostri esperti di infrastrutture fisiche per l'AI al Vertiv AI Innovation Roadshow. Ottieni approfondimenti sugli effetti dell'IT accelerato e dell'HPC sui data center, sulle sfide e opportunità, e su cosa potrebbe significare il percorso verso una maggiore densità per le tue implementazioni.

Scopri le soluzioni AI-ready di Vertiv in diverse città in Europa e Medio Oriente. La nostra prima tappa sarà a Londra (UK) l'11 luglio. Esplora l'elenco completo delle città per trovare una tappa vicino a te.

Registrati oggi per scoprire come il portfolio completo AI-ready di Vertiv alimenta e raffredda anche i carichi di lavoro più densi nelle implementazioni più impegnative.

Soluzioni end-to-end per affrontare i carichi AI

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Tappa del Roadshow

Select Dates London - July 11th Munich - September 5th Riyadh - September 25th Athens - October 3rd Madrid - October 8th Milan - October 10th Warsaw - October 15th Paris - October 17th Zagreb - October 24th Dubai - November 7th Istanbul - November 14th

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Learn more about Services

Vertiv possiede l'expertise tecnologica, l'ampiezza del portfolio, i servizi, l'impronta operativa e le partnership di settore per alimentare e raffreddare i tuoi deployment HPC. Unisciti a noi per saperne di più sulle soluzioni che renderanno il tuo business pronto per l’AI.

Fattori chiave di crescita

Lo sviluppo dei più recenti server AI sta portando i carichi termici a raggiungere dai 6 kW ai 10 kW per server. Inoltre, le densità di calore di chip, server e rack continuano ad aumentare.

Scopri quando adottare il liquid cooling per affrontare le crescenti densità dei rack