Liebert® XDU450 Coolant Distribution Unit
Designed to support liquid cooling within high density environments, the Liebert® XDU450 Coolant Distribution Unit is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Liebert® XDU450 utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
Saved This Product to Your Dashboard
You just saved this product to your dashboard to view at a later time. You can easily remove the item from your dashboard when you no longer wish to have it saved.
Please login or create an account to save this for later
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Liebert® XDU450 Coolant Distribution Unit
Designed to support liquid cooling within high density environments, the Liebert® XDU450 Coolant Distribution Unit is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Liebert® XDU450 utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Benefits
Features
Specifications
As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (the next generation of the Liebert® XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv CoolChip CDU’s compact footprint allows for in-rack, end of row, or perimeter placement options. However, and wherever you incorporate the Vertiv CoolChip CDU, you can easily distribute coolant to efficiently manage power-dense hot spots with liquid-to-liquid heat exchange up to 100 kw, 450 kW, 600 kW, or 1,350 KW, and liquid-to-air heat exchange up to 70kW. The Vertiv CoolChip CDU provides a compact footprint for deployment flexibility, efficient coolant distribution to manage power dense hot-spots, precise temperature control to eliminate thermal shock, redundant pumps and dual power feeds for reliable operation, and remote monitoring and communications for added peace of mind.
- Product Specifications
- Net Sensible Nominal Capacity kBtuh[kW]*
- 453 kW at 7.2 F (4 C): Secondary Circuit flow rate at 110 GPM ( 450 l/m) at 29 psi ( 2 bar) external ΔP
- Input Voltage (V/Phase/Frequency Hz)
- 208 v 60 Hz 3 phase; 480v 60 Hz 3 phase
- Controls and Monitoring
- Color touch screen display
- Key Components
- Redundant pump design with variable-speed pump controls
- Physical Characteristics
- Weight
- 848 lbs
- Weight
- 385 kgs
- Height
- 74.8 in
- Height
- 1900 mm
- Width
- 23.6 in
- Width
- 600 mm
- Depth
- 41 in
- Depth
- 1043 mm
*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.