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Product Model

Liebert® XDU1350 Coolant Distribution Unit

Designed to support liquid cooling within high density environments, the Liebert® XDU1350 Coolant Distribution Unit is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Liebert® XDU1350 utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.

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Best Suited For:
  • Data Center/Colocation/Hosting
  • Education
  • Government
  • Healthcare
  • Retail and Wholesale

Benefits

Achieve incredible efficiency in high-density environments
Protects secondary liquid network with strict conformance to wetted material compatibility
Intuitively designed for ease of deployment
Accommodates any facility design and with multiple cooling configurations
Robust design with confidence inspiring redundancy options including teaming for the most demanding applications
Integrated controller designed from the ground up to be easy to deploy and supports leak detection
Flexible support services available for installation and maintenance with same day options

Features

Compact footprint allows for in-row deployments
Top or bottom liquid supply & return connections
Integrated 50 micron filter
Large 7”responsive color touch screen display
Precise Temperature Control to eliminate thermal shock for server CPU and GPUs
Intelligent flow monitoring with alarm features
Closed-loop pipe design with integrated leak detection
Easily accessible fill port and drain locations
Innovative Stainless-Steel Design and Hygienic Couplings help ensure Secondary Fluid Network integrity

As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (the next generation of the Liebert® XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv CoolChip CDU’s compact footprint allows for in-rack, end of row, or perimeter placement options. However, and wherever you incorporate the Vertiv CoolChip CDU, you can easily distribute coolant to efficiently manage power-dense hot spots with liquid-to-liquid heat exchange up to 100 kw, 450 kW, 600 kW, or 1,350 KW, and liquid-to-air heat exchange up to 70kW. The Vertiv CoolChip CDU provides a compact footprint for deployment flexibility, efficient coolant distribution to manage power dense hot-spots, precise temperature control to eliminate thermal shock, redundant pumps and dual power feeds for reliable operation, and remote monitoring and communications for added peace of mind.

Liebert® XDU1350 Coolant Distribution Unit
Product Specifications
Net Sensible Nominal Capacity kBtuh[kW]*
1368 kW at 7.2 F (4 C): Secondary Circuit flow rate at 320 GPM (1200 l/m) at 35.4 psi ( 2.44 bar) external ΔP
Input Voltage (V/Phase/Frequency Hz)
480 V ,3PH, 60Hz
Controls and Monitoring
Color touch screen display
Key Components
Redundant pump design with variable-speed pump controls
Physical Characteristics
Weight
1431 lbs
Weight
1509 kgs
Height
684 in
Height
2070 mm
Width
35.4 in
Width
900 mm
Depth
48.9 in
Depth
1242 mm

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Products Support Contacts

Showing contacts for Ohio, 43215, USA Change
Vertiv (Liebert Services)
+1 800 543 2378
610 Executive Campus Drive Westerville Ohio 43082 USA
Product areas of focus: Uninterruptible Power Supplies (UPS), Power Distribution, Thermal Management, Integrated Solutions, Racks and Containment
Vertiv Academy – Thermal Management Training
+1 844 841 2665
530 Westar Blvd Westerville Ohio 43082 USA
Product areas of focus: Thermal Management
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