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Product Family

Vertiv™ CoolLoop Trim Cooler - The free cooling AI-ready cooler from 850 to 2600 kW

The Vertiv™ CoolLoop Trim Cooler is the free cooling AI-ready, densification-ready, environmentally responsible solution specifically designed to prepare data centers for growing densification driven by AI advancements.

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Key Benefits
​AI & Densification-ready with an efficiency increase of nearly 70%.
Up to 2.6 MW of cooling capacity, reaching 3 MW in the air-cooled configurations.
Compact design with a net gain of over 40% cooling capacity.
Liquid cooling-ready supporting both air- and hybrid- cooled configurations.
Free cooling optimization minimizing power consumption to handle operational peaks.
Compliant with major current and future bans and EU F-Gas regulations for years to come.
R1234ze inverter driven technology to maximise efficiency.
Global solution, suitable for data centers in various climates around the world.
Best Suited For:
  • Banking
  • Financial and Insurance
  • Data Center/Colocation/Hosting
  • Government
  • Manufacturing

Benefits

AI & Densification-ready with a future-oriented mindset: Supports AI-driven densification advancements. Achieve up to 1.087 pPUE, with an efficiency increase of nearly 70%*.
Compact and efficient design: Net gain of over 40% cooling capacity without increasing the overall footprint.
Liquid cooling-ready: Supporting both air- and hybrid-cooled configurations combining both air and liquid cooling capacity.
Eco-conscious cooling: Compliant with major current and future bans and EU F-Gas regulations for years to come, lowering CO2e emissions and granting maximum seasonal efficiency, especially at partial load.
Free cooling optimization: Handle operational peaks while minimizing power consumption, providing increased flexibility.
Improved efficiency: The inverter-driven technology used for compressors, EC fans, and user pumps.
Space efficiency: No additional roof space occupancy is required.
Global flexibility for data centers worldwide: Suitable for data centers in various climates around the world.

*Air-cooled IT load of 10 MW running at 80% capacity with water temperatures at 20°C achieving a pPUE of 1.15 with standard chillers. At a higher temperature of 35°C with Vertiv™ CoolLoop Trim Cooler achieving a higher pPUE estimated at 1.087 and an efficiency increase of nearly 70%.

Features

Up to 40°C supply water temperature.​
Up to almost 3 MW** of cooling capacity in a single, compact frame.
Easy coupling with Vertiv™ CoolChip CDU and Vertiv™ CoolCenter Immersion systems.​
Very low-GWP R1234ze refrigerant (GWP = 7 as per IPCC AR4).
Free cooling coils optimized for high ambient temperatures incorporating microchannel heat exchangers for superior heat transfer.
Inverter-driven technology.
Active harmonic filters in the electrical panel.
Wide range of external temperatures from -20°C to over 52°C.

**In the air-cooled configuration

*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.

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Products Support Contacts

Showing contacts for Ohio, 43215, USA Change
Vertiv (Liebert Services)
+1 800 543 2378
610 Executive Campus Drive Westerville Ohio 43082 USA
Product areas of focus: Uninterruptible Power Supplies (UPS), Power Distribution, Thermal Management, Integrated Solutions, Racks and Containment
Vertiv Academy – Thermal Management Training
+1 844 841 2665
530 Westar Blvd Westerville Ohio 43082 USA
Product areas of focus: Thermal Management

Customer stories

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A roadmap for the future chip coolant temperature

Learn why manufacturers and data center operators prefer 30°C as the optimal temperature for cooling AI silicon in data centers. Read the technical factors affecting this temperature and identify the paths for future technological improvement to increase and optimize performance.

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High temperature fluid coolers

In today’s rapidly evolving tech landscape, the pressure is on to stay ahead of the curve—especially in terms of cooling hyperscale and colocation data centers. As technology continues to advance and chip power density increases, managing temperature within data centers has become, and will remain, an ongoing and critical challenge.

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Welcome to our Thermal Management Customer Experience Center!

Visit our Technology Innovation Labs and discover available tests for Thermal Management units in a virtual environment.

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