DCD broadcast: AI week 2024

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: DCD broadcast: AI week 2024; 2024/07/29 02:00; 2024/08/02 02:00
: 7月29日 - 8月2日

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Designing for AI from the chip to the grid level

AI week has been designed to provide a critical update of the state of the high performance computing landscape. With so much ambiguity around terminology and myriad solutions boasting the label ‘AI ready’, how can data center leaders discern the right tools for their nuanced problems? Against a power and space constrained backdrop, making the right decisions from the chip to the grid level is both mission and business critical.

The executive perspective on the data center AI revolution

As AI continues to transform industries, gaining a holistic view of the forces shaping the data center market is essential to understand the end to end impact of next generation computing. Who better to provide this perspective than a person who can see above the siloes of an operation? In this episode, we are joined in conversation with Giordano Albertazzi, CEO, Vertiv to provide deep insights into the latest AI trends, the new challenges data centers face, and Vertiv's strategic priorities in supporting AI. Highlights include:

What are the most significant threats to uptime?
The biggest challenges of scaling operations in line with AI
What is the data center industry doing to minimize the environmental impacts of AI?
How are we seeing innovation, competition and industry collaboration drive AI growth?

Available on demand

Speakers:

Giordano Albertazzi
Vertiv

Dan Loosemore
CEO, DCD

Develop grid resilience by achieving power independence

AI workloads demand megawatts upon megawatts of reliable power, with the appetite for compute only set to grow. In many regions, it is clear that the grid will simply not be able to meet this demand robustly. Therefore, operators must take power into their own hands to secure their supply. Is developing microgrids becoming a non-negotiable for data centers looking to scale in line with AI? In this episode, we explore:

The critical role of decentralized power in an AI age
How unparallelled resilience is achieved through utilizing power protection technologies
Going beyond island mode: Leveraging microgrids to give back to the utility
Load balancing in the AI era: Does UPS technology need to protect the grid from the data center?
Drawing on practical examples to highlight the tangible benefits of energy independence

Schedule:

Date: Tuesday, July 30, 2024

Time: 11:00 AM-12:00 ET

Speakers:

Kyle Keeper
SVP, Power Management, Vertiv

Arturo Di Filippi
Offering Director, Large Power, Vertiv

Marinella Massacesi
Business Development Manager EMEA - Energy Storage, Vertiv

Stephen Worn
CTO and Managing Director, NAM, DatacenterDynamics

How to increase facility and rack densities

Meeting the demands of AI necessitates densification across many layers of the data center—from chips to power, cooling to networks, and other essential equipment. Managing these elements in increasingly confined spaces presents numerous challenges, coupled with the need to maintain performance and drive efficiency. As the underlying infrastructure requires modernization to keep pace with AI workloads, what elements should we prioritize? The episode addresses:

The critical role of intelligent power technologies in provisioning for AI and managing loads
Options for thermal management in high density environments
How technologies are being scaled to facilitate business growth

Schedule:

Date: Wednesday, July 31, 2024

Time: 1:00 PM-2:00 PM ET

Speakers:

John Menoche
Sr. Solutions Architect, Integrated Solutions, Vertiv

Aaron Badowski
Product Manager, Infrastructure Solutions, Vertiv

Dan Swinhoe
Senior Editor, Datacenter Dynamics, DCD

Cooling the cutting edge of AI technologies

Effective thermal management and power efficiency are critical to ensuring the performance and longevity of cutting edge AI chips. In this session, we delve into the technical challenges, as well as the way around, for managing these demands. During this episode, we address:

The role of chip level cooling in effective heat management
How do different thermal management solutions stack up?
What comes next in cooling and power management technologies?
How strategic partnerships with chip manufacturers allow cooling solutions that maximise both efficiency and performance

Schedule:

Date: Thursday, August 1, 2024

Time: 9:00 AM-10:00 AM ET

Speakers:

Greg Stover
Global Director, Hi-Tech Development, Vertiv

Husam Alissa
Director - Systems Technology, Microsoft

Stephen Worn
CTO and Managing Director, NAM, DatacenterDynamics

Bahareh Eslami
Senior Mechanical Engineer, Nvidia

The future of AI and HPC

So far the build out of AI has relied heavily on the know-how and lessons learned from HPC technologies. However, we have reached an inflection point where AI can no longer use this as a de facto standard and must forge its own path. During this episode we explore the diverging futures of AI and HPC, and consider whether these technologies may organically converge again further down the line.

Setting the record straight: How do we delineate AI from HPC?
The need for industry standards and benchmarking
What is the future of energy-efficient hardware?
Market trends and geopolitical tensions shaping the advanced computing landscape

Schedule:

Date: Friday, August 2, 2024

Time: 9:00 AM-10:00 AM ET

Speakers:

Stephen Liang
Chief Technology Officer, Vertiv

Martin Olsen
SVP, Strategy and Planning, Vertiv

David McCall
Vice President of Innovation, QTS Data Centers

Alex Dickins
Channel Management Team Lead, DatacenterDynamics, DCD

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DCD broadcast: AI week 2024

Designing for AI from the chip to the grid level

The executive perspective on the data center AI revolution

Schedule:

Speakers:

Develop grid resilience by achieving power independence

Schedule:

Speakers:

How to increase facility and rack densities

Schedule:

Speakers:

Cooling the cutting edge of AI technologies

Schedule:

Speakers:

The future of AI and HPC

Schedule:

Speakers:

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