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Live stream

DCD AI Week: The executive perspective on the data center AI revolution with Vertiv CEO, Giordano Albertazzi

July 29 | 9:00 am ET

 

See design principles

 
 

Challenges to data centers

You need more power.

High-density power solutions must cope with new power draw and increased grid constraints.

Air cooling alone is not enough.

Compute-intensive chips require new cooling technologies that ensure silicon does not overheat.

Rising complexity and continuity demands.

New and evolving technologies increase complexity, but continuity can never waver.

Unlock deeper AI insights and stay ahead of the curve

How to implement liquid cooling at existing data centers

Read our technical guide for practical strategies and a step-by-step roadmap for adopting liquid cooling for 1MW IT loads.

Read more

Join us at these events

July 29– August 2, 2024

DCD AI Week: Designing for AI from the chip to the grid level

Episodes streaming live in ET

October 7-9, 2024

YOTTA: The Future of Digital Infrastructure

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October 15-17, 2024

2024 OCP Global Summit

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Design smarter systems for AI

Optimize your data center with integrated power and cooling retrofit design solutions

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Deploy AI Faster

Slash deployment time by 50% with pre-engineered solutions

Accelerate deployment
 
 

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