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Product Model

Vertiv™ CoolChip CDU, 600kW

Designed to support liquid cooling within high density environments, the Vertiv™ CoolChip CDU 600kW is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.

Key Benefits
• Essential separation of the primary (facility) liquid loop, from the secondary (ITE) cooling loop • Deliver exceptional direct-to-chip and RDHx cooling capacity to accommodate high density racks • Improved quality and reliability with redundant pumps, built-in filtration, and unit-to-unit communication capabilities
Best Suited For:
  • Data Center/Colocation/Hosting
  • Education
  • Government
  • Healthcare
  • Retail and Wholesale

Benefits

• Achieve incredible efficiency in high-density environments • Protects secondary liquid network with strict confornance to wetted material compatibility • Intuitively designed for ease of deployment • Accomodates any facility design and with multiple cooling configurations • Robust design with confidence inspiring redundancy options including teaming for the most demanding applications • Integrated controller designed from the ground up to be easy and supports leak detection • Flexible support services available for installation and maintenance with same day options

Features

• Compact footprint allows for in-row deployments • Top or bottom liquid supply & return connections • Integrated 50 micron filter • Large 7" responsive color touch screen display • Precise temperature control to eliminate thermal shock for server CPU and GPUs • Intelligent flow monitoring with alarm features • Closed-loop pipe design with integrated leak detection • Easily accessible fill port and drain locations • Innovative Stainless-Steel Designand Hygenic Couplings help ensure Secondary Fluid Network integrity

As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (the next generation of the Liebert® XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv CoolChip CDU’s compact footprint allows for in-rack, end of row, or perimeter placement options. However, and wherever you incorporate the Vertiv CoolChip CDU, you can easily distribute coolant to efficiently manage power-dense hot spots with liquid-to-liquid heat exchange up to 100 kw, 450 kW, 600 kW, or 1,350 KW, and liquid-to-air heat exchange up to 70kW. The Vertiv CoolChip CDU provides a compact footprint for deployment flexibility, efficient coolant distribution to manage power dense hot-spots, precise temperature control to eliminate thermal shock, redundant pumps and dual power feeds for reliable operation, and remote monitoring and communications for added peace of mind.

Vertiv™ CoolChip CDU, 600kW
Product Specifications
Net Sensible Nominal Capacity kBtuh[kW]*
600 kW at 7.2⁰F (4⁰C) approach temperature difference
Controls and Monitoring
Color touch screen display, Communication via Modbus RTU (RS485) and TCP/IP
Key Components
Redundant pump design, variable-speed pump controls, and integrated filtration
Physical Characteristics
Weight
946 lbs
Weight
429 kg
Height
78.7 in
Height
2000 mm
Width
23.6 in
Width
600 mm
Depth
47.2 in
Depth
1200 mm

Find Your Area Contact

Products Support Contacts

Showing contacts for Ohio, 43215, USA Change
Vertiv (Liebert Services)
+1 800 543 2378
610 Executive Campus Drive Westerville Ohio 43082 USA
Product areas of focus: Uninterruptible Power Supplies (UPS), Power Distribution, Thermal Management, Integrated Solutions, Racks and Containment
Vertiv Academy – Thermal Management Training
+1 844 841 2665
530 Westar Blvd Westerville Ohio 43082 USA
Product areas of focus: Thermal Management
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