Vertiv™ Liebert® XDU Coolant Distribution Units
Designed to support liquid cooling within high density environments, the Liebert® XDU Coolant Distribution Units are suitable for chip & rear door cooling applications that offer easy, cost-effective deployment in any data center. The Liebert XDU family offers systems that operate with/without facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
Saved This Product to Your Dashboard
You just saved this product to your dashboard to view at a later time. You can easily remove the item from your dashboard when you no longer wish to have it saved.
Please login or create an account to save this for later
- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Vertiv™ Liebert® XDU Coolant Distribution Units
Designed to support liquid cooling within high density environments, the Liebert® XDU Coolant Distribution Units are suitable for chip & rear door cooling applications that offer easy, cost-effective deployment in any data center. The Liebert XDU family offers systems that operate with/without facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Specifications
As data centers adopt liquid cooling, fitting in new cooling distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ Liebert® XDU simplifies your work with the flexibility to support rear door heat exchangers or direct contact liquid cooling. The Liebert® XDU’s compact footprint allows for end of row or perimeter placement. However, and wherever you incorporate the Liebert XDU, you can easily distribute coolant to efficiently manage power-dense hot spots liquid to liquid up to 450 kW or 1,368 KW. Compact footprint for deployment flexibility within the row or perimeter; Efficient Cooling Distribution to manage power-dense hot spots and up to 450 kW or 1,368 kW; Precise Temperature Control to eliminate thermal shock for server CPU and GPUs; Redundant Pumps and Dual Power Feeds for optimizing reliable operation; Remote Monitoring available through communications with HTTP, SNMP, RS-485 Modbus, Modbus IP.
